Macronix 3D-NAND delay reported

January 28, 2019 // By Peter Clarke
The entry into the 3D-NAND flash market of Macronix International Co. Ltd. (Hsinchu, Taiwan) is now set to take place with 128- and 256Gbit products at the end of 2020, according to a Digitimes report that referenced company president CY Lu as its source.

This is a couple of years later than company CEO Miin Wu told eeNews Europe would be the case back in 2016 (see Macronix preps 3D-NAND market entry, says CEO ). At that time Wu said Macronix was working towards a 3D-NAND product introduction in 2018, which the company would make at one of its three wafer fabs in Taiwan.

The latest report said Macronix is working on 48- and 96-layer processes to deliver 128Gbit and 256Gbit products.

In order to meet the production schedule, Macronix is increasing R&D efforts and will upgrade its 300mm wafer fabrication process, the report quoted Lu as saying.

Macronix is moving to a 19nm process for conventional 2D NAND flash chips and manufacturing NOR flash products using mainly 55nm process technology.

Related links and articles:

www.mxic.com.tw

Digitimes report

News articles:

Macronix debuts automotive NAND flash

Macronix 'read-while-write' flash adopted by Renesas

'Xtacking' approach offers faster 3D-NAND, claims Yangtze

Macronix rolls out European expansion plan


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